Standard 2-layer or 4-layer boards cannot support high-speed digital logic. The course dives deep into designing 6-layer (or higher) stack-ups, establishing controlled impedance traces (e.g., 50-ohm single-ended and 100-ohm differential pairs), and configuring dedicated ground and power planes to minimize electromagnetic interference (EMI). 4. DDR3 Memory Routing and Signal Integrity
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Instead of just using evaluation boards, the 2021 content often focused on creating custom PCB designs centered around powerful FPGAs, such as the Xilinx Artix-7 series.